Equipment Resources

Equipment resources for the various subdivisions of the Prototyping Facility can be reached by following the links below.

Here is an equipment resources PDF showing the basic path for accessing these resources (one example).

Additionally, the horizontal menu bar at the top of each page of this website area contains shortcut links to each room's equipment resources.

Equipment Resources Diagram showing where each room is located

Scribe Room

This is the first room encountered when entering the Prototyping Facility. It is Class 10,000.

This room houses capabilities for glass scribing (machine and hand), end-seal pressing, ellipsometry and cell-filling devices (vertical and horizontal).

Users do not need to be fully gowned up when working in this room, but still need to wear a smock, safety glasses and gloves.

Standard Processes Room

This is the first room encountered when entering the Prototyping Facility past the gowning room. It is Class 1000.

This room houses capabilities for processing 4" glass substrates with our standard processes, to make low volumes of cells at low resolution.

These capabilities include: ultrasonic cleaning, solvent wash, oven dry, photoresist spin coating and hot plate flash, UV flood exposure (noncollimated), chemical lithographic processing (resist develop, acid etch, chemical strip), UV ozone cleaning (RT), polyimide spin coating, oven baking, surface rubbing; spacer and adhesive gasket application, plate-to-plate assembly and alignment, pressing and high intensity UV cure.

This room's main purpose is for new users and the processes designed in this room mostly follow pre-established standard procedures.

Flexible Processes Room

This is the second room encountered in the cleanroom, after passing through the front room through the curtain divider. It is Class 1000.

This room houses capabilities for processing up to 7" glass substrates with standard processes to make higher volumes of cells at low or high resolution. Also, this part of the facility is used to work with nonstandard materials and to develop nonstandard or new processing techniques.

The basic capabilities include: ultrasonic cleaning, solvent wash, oven dry, photoresist spin coating and hot plate flash, UV exposure (collimated), chemical lithographic processing (resist develop, acid etch, chemical strip), UV ozone cleaning (RT), polyimide spin coating, oven baking, spacer and adhesive gasket application, plate-to-plate assembly and alignment, pressing and low or high intensity UV cure.

This room's main purpose is for advanced users, and both standard and nonstandard processes can be performed here.

Class 100 Room

This room is separated from the main room by a physical doorway. It is Class 100.

This room houses some unique capabilities and supports activities performed in the front room. 

The basic capabilities include: high resolution UV mask exposure, high accuracy plate-to-plate alignment and mate, profilometry, microscopy, offset printing and inkjet printing.

Rub Room

This room is not located at the rear of the prototyping facility. It is Class 1000.

This room has our large rub machine as well as some reservable (rentable) cleanroom space for long-term, resident, industrial partners.

Deposition Room

This room is not located inside the prototyping facility but is located on the first floor of LCI, Room 178. It is not cleanroom space.

This room houses primarily capabilities for vapor deposition techniques used for depositing SiOx (at various angles), Gold, Aluminum, Nickel and ITO. It also houses capabilities in 3D printing, and environmental humidity and UV exposure testing.